Canteliver Probe Card
MPI Cantilever Probe Card is extensively used on gold bump and pad wafer testing for Exhibit driver, logic, and memory device. MPI’s cantilever probes are definitely the corresponding solution on the requires of fine pitch, compact pad size, large pace, less cleaning, multi-DUT, large pin rely, and ultra-lower leakage prerequisites. With outstanding craftsmanship, modern architecture and demonstrated methodologies dependant on mechanical and electrical simulation/measurement success, making MPI the top cantilever provider globally.
FCB Probe Card
The FCB Probe Card is among the most mature technology of buckling beam probe card. It is aimed to achieve the semiconductor ship manufacture time-to-market (TTM) and price of exam (COT) desire. FCB is often a demonstrated Option for various semiconductor creation exams from early engineering pilot-runs to superior quantity production (HVM). FCB is ready for product necessitating large signal integrity probing (SI) and/or ability integrity probing (PI). Apps contain cutting-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and more. FCB ensures the entire world’s finest Total Price-of-possession (COO) for a variety of DUT applications.
EVS Probe Card
The EVS Probe Card can be an enhancement over the traditional buckling beam probe card. Important options are increased current carrying ability (C.C.C.) and reduce well balanced Make contact with drive (BCF), along with overall MEMS-like attributes. EVS can easily satisfy the need of Superior wafer probing. Specific alignment and outstanding planarity Command are classified as the vital aspects contributing to secure contact resistance. With its ability and performance, EVS Probe Card is a great option for advanced probe cards.
Osprey probe card
The Osprey probe card is MPI’s Resolution to demand from customers for ever finer pitch. It truly is suitable for smaller Al pad, and is also perfect for very small pitch software with peripheral and full array pattern. With exact alignment and greater planarity Command, Osprey can reach greater productiveness by multi-DUT layout. The forming wire get more info (FW) form needle produced with MPI’s personal micro fabrication method not merely delivers substantial-excellent general performance but also enables simple needle substitute and shortens preserving cycle time.
Kestrel Probe Card
The Kestrel Probe Card is equipped with MEMS wire (MW) needle that is made for the demand of reduced force probing. Additionally, it comes with the ability to fulfill significant C.C.C. and significant pin counts application. The MEMS method guarantees extremely consistent needle characteristics, and the Distinctive framework layout enables specific alignment and planarity Command.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
https://www.mpi-corporation.com/probecard/
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